| PART |
Description |
Maker |
| MMBTA92 |
Epitaxial Planar Die Construction
|
SHIKE Electronics
|
| BZT52C30 BZT52C9V1 BZT52C5V1 |
1/2 Watt ZEBER DIODES Planar Die Construction
|
First Components International
First Components Intern...
|
| 1N5819-T 1N5817-B 1N5817-T 1N5818-B 1N5819-B 1N581 |
Through-Hole Schottky Rectifiers
Guard Ring Die Construction for Transient Protection
|
Diodes Incorporated
|
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| DXO10701095-5 |
Planar Resonator Construction
|
SYNERGY MICROWAVE CORPO...
|
| DXO885915-5 |
Planar Resonator Construction
|
SYNERGY MICROWAVE CORPO...
|
| TIP112 |
EPITAXIAL PLANAR NPN TRANSISTOR (MONOLITHIC CONSTRUCTION WITH BUILT IN BASE-EMITTER SHUNT RESISTORS INDUSTRIAL USE.)
|
KEC[KEC(Korea Electronics)]
|
| TIP112F |
EPITAXIAL PLANAR NPN TRANSISTOR (MONOLITHIC CONSTRUCTION WITH BUILT IN BASE-EMITTER SHUNT RESISTORS INDUSTRIAL USE.)
|
KEC[KEC(Korea Electronics)]
|
| 1N4007G 1N4004G 1N4001G 1N4002G 1N4002 1N4006 1N40 |
Rectifiers(整流 1 A, 1000 V, SILICON, SIGNAL DIODE
(1N4001G - 1N4007G) Rectifiers(Rugged glass package / using a high temperature alloyed construction)
IC REG VOLT 4.8V 240MA SOT-23
Rectifiers(Rugged glass package/ using a high temperature alloyed construction)
Rectifiers(Rugged glass package, using a high temperature alloyed construction) 1 A, 50 V, SILICON, SIGNAL DIODE
Rectifiers(Rugged glass package, using a high temperature alloyed construction) 整流器（坚固的玻璃封装，采用高温合金建设
Rectifiers(Rugged glass package, using a high temperature alloyed construction) 1 A, 400 V, SILICON, SIGNAL DIODE
|
PHILIPS[Philips Semiconductors]
http://
NXP Semiconductors N.V.
|
| 1212691 |
Replacement die - CF 500/DIE RCI 6-1
|
PHOENIX CONTACT
|
| 1N749A 1N746A 1N746 1N750A 1N759A 1N4370A 1N4371A |
DOUBLE PLUG CONSTRUCTION
Zener Diodes(齐纳二极 齐纳二极管（齐纳二极管）
Zener Voltage Regulator Diode 齐纳稳压二极
DOUBLE PLUG CONSTRUCTION 双插头施
SIDE GRIPS, PAIR BLUE LARGESIDE GRIPS, PAIR BLUE LARGE; Colour:Blue; Pack size:2
|
Compensated Deuices Incorpo...
Motorola Mobility Holdings, Inc.
Microsemi, Corp.
NXP Semiconductors N.V.
CDI-DIODE[Compensated Deuices Incorporated]
Compensated Devices Incorporated
Compensated Deuices Inc...
|
